Jong Hoon Lee,Manos M. Tentzeris,Constantine A. Balanis: Three-Dimensional Integration and Modeling : A Revolution in RF and Wireless Packaging

Three-Dimensional Integration and Modeling : A Revolution in RF and Wireless Packaging


Description

This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization.Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.


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Author: Jong Hoon Lee,Manos M. Tentzeris,Constantine A. Balanis
Number of Pages: 108 pages
Published Date: 07 Oct 2007
Publisher: Morgan & Claypool Publishers
Publication Country: San Rafael, United States
Language: English
ISBN: 9781598292442
Download Link: Click Here
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